一般制程能力
1) 材质Base material: FR-4 /CEM-3
2) 规格Layers: 2-8
3) 板厚Board thickness: 0.4 – 2.0mm

(0.4mm/0.6mm/0.8mm/1.0mm/1.2mm/1.6mm/2.0mm)
4) 最小孔径Min. finished hole size: 0.30mm, Min line width: 0.1mm
5) 最小线路Min. line space: 0.1mm, Min hole space: 0. 30mm
6) 外形Outline: routing, punching, V-cut.
7) 阻焊Solder mask: green/yellow/black/white/red/blue
8) 表面处理Surface finishing: HAL, Lead free HAL, gold plating, OSP,

Immersion gold.
9) 铜厚Copper thickness: 0.5oz, 1oz, 2oz
10) 内包装Inner packing: vacuum package, handwork package
   外包装Outer packing: carton
11) 检验标准Taking IPC-1710A standard.
12) 品质标准Internal quality standard: ISO
13) 环保级别SGS/ Rosh/UL compliance