General Information:
 
1) Base material: FR-4 /CEM-3
2) Layers: 2-8
3) Board thickness: 0.4 – 2.0mm

(0.4mm/0.6mm/0.8mm/1.0mm/1.2mm/1.6mm/2.0mm)
4) Min. finished hole size: 0.30mm, Min line width: 0.1mm
5) Min. line space: 0.1mm, Min hole space: 0. 30mm
6) Outline: routing, punching, V-cut.
7) Solder mask: green/yellow/black/white/red/blue
8) Surface finishing: HAL, Lead free HAL, gold plating, OSP, Immersion

gold.
9) Copper thickness: 0.5oz, 1oz, 2oz
10) Inner packing: vacuum package, handwork package
   Outer packing: carton
11) Taking IPC-1710A standard.
12) Internal quality standard: ISO
13) SGS/ Rosh/UL compliance